About Us

Engineering and Sciences - International Conference (ESIC 2024), organized by Department of Engineering Physics, School of Electrical Engineering, Telkom University.

ESIC 2024 is your venue of opportunity to share and showcase your idea, work, and experiences with colleagues from around the world. Present yourself to groups of researcher, professionals, and policy experts who may be your potential collaborator, sponsor, and supporter in ESIC 2024. Academicians, Students, Industry Professionals, Government Employees, Non-Governmental Organizations, Independent, etc. are welcomed to present their idea, work, and experiences in ESIC 2024.

What is Our Goal?

The ESIC 2024 provides an opportunity for participants to engage in discussions and deliberations on advancements in science and technology, fostering collaborations in research.

Hybrid Conference

The ESIC 2024 will be held as a hybrid event at Bandung, Indonesia, and through an online platform via the Zoom Conferencing App.


There are invited speakers, keynote speakers, and parallel sessions. All accepted papers will be published in IOP Conference Proceeding indexed by Scopus.


The conference will cover various topics, including, but not limited to:

  • Energy
  • Energy conversion technology • Biomass • Biotechnology and bioprocess • Renewable energy Energy management system Green technology • Energy storage

  • Material
  • Nanomaterials and nanotechnology • Photonics technology • Battery and storage technology • Synthesis and material characterization • Sensor and Biosensor

  • Instrumentation
  • Internet of Things (IoT). • Robotics and Artificial intelligence (AI). • Smart and adaptive control. Electrical and electronics technology. • Industrial instrumentation. • Smart grid and building. • Environmental engineering and natural resources.

Sept. 17-18

in Bandung


3 Keynote, 3 Invited

Keynote Speakers

Prof. Aloysius Adya Pramudita

CoE Intelligent-Sensing IoT, Telkom University, Indonesia

Assoc. Prof. Nor Hakimin Abdullah

Universiti Malaysia Kelantan, Malaysia

Prof. Chang-Dae Park*

Korea Institute of Machine, Korea

Invited Speakers

Dr. Ahmad Ridwan

National Research & Innovation Agency (BRIN), Indonesia

Saladin Prawirasasra, M.T

Tallinn University, Estonia

Dr. Deni Shidqi Khaerudini

National Research & Innovation Agency (BRIN), Indonesia


All Extended Abstract and Full Paper Submission must be submitted through Morressier Platform. The Morressier submission portal can be found here. The Morressier guidelines for authors can be download here. Participation in the ESIC 2024 is limited to registered attendees. It is mandatory for at least one author of an accepted paper to register in order for the paper to appear in the proceedings and Technical Program. Your full registration includes:
  • Admission to all sessions.
  • To be included in the conference proceedings series as a recognized author.
  • Publication of the accepted submission in the conference proceedings.
  • Access to the presentation pre-recorded video and conference recording.
  • Get a signed electronic certificate of participation.
Questions regarding the Call for Papers or ESIC 2024 may be delivered to the committee through email at [email protected].

Important Dates

  • Extended Abstract Submission: Apr 04 - Jul 04 25, 2024
  • Extended Abstract Acceptance Notification: Jul 04 - 30, 2024
  • Early bird Registration Deadline: Jul 04 25, 2024
  • Regular Registration Deadline: Aug 15, 2024
  • Full Paper Submission: Aug 15, 2024
  • Camera Ready Paper Submission: Sept 09, 2024
  • PPT and Recorded Video: Sept 09, 2024

Registration Fee

Payments must be done via Wire Transfer/Bank transfer to the ESIC Conference.

1. Payment from Indonesia can be transferred to BNI Virtual Account: 8321066202400076
2. The overseas payment is transferred to:

After performing Wire Transfer/Bank transfer, payment slip should be scanned and emailed to [email protected] for confirmation. Please write “ESIC Payment – [Paper ID]” on email header.

Due Date: Jul 04 25, 2024

Early Bird

Local Student: IDR 2.500.000
Local Non-Student: IDR 3.500.000
International Student: USD 225
International Non-Student: USD 425
Due Date: Aug 15, 2024


Local Student: IDR 3.000.000
Local Non-Student: IDR 4.000.000
International Student: USD 250
International Non-Student: USD 450
Due Date: Aug 15, 2024


Local: IDR 500.000
International: USD 50

Submit Your Contribution Work

ESIC 2024 is your venue of opportunity to share and showcase your idea, work, and experiences with colleagues from around the world.

Submit Now!


  • Scientific Committee
  • • DR. ENG. IR. Christina Wahyu Kartikomawati, S.T., M.T. (Brawijaya University, Indonesia)
    • Prof Jangkung (Telkom University, Indonesia)
    • Prof Suyanto (Telkom University, Indonesia)
    • Prof. ratno nuryadi (BRIN, Indonesia)
    • Triati Dewi Kencana Wungu (ITB, Indonesia)
    • Farid Wijaya, PhD (IESR, Indonesia)
    • Rohib (Institut de Recherches sur la Catalyse et l'Environnement de Lyon (IRCELYON), Prancis)
  • Guest Editor/Editorial Board
  • • Indra wahyudin Fathona (Telkom University)
    • Ahmad Zulfikri Taning, Ph.D (Shinshu National University, Japan)
    • Aditia Nur Bakti, Ph.D. (BRIN, Indonesia)
    • Mohammad Talafha, M.Eng (Jordan Atomic Energy Commission, Jordan)
    • osi arutanti (BRIN, Indonesia)
    • Yuliar Firdaus (BRIN, Indonesia)
    • Ario Betha Juansilfero (BRIN, Indonesia)
    • Mamat Rokhmat (Telkom University, Indonesia)
    • Dian Ahmad Hapidin (ITB, Indonesia)
    • Elfi Yuliza (UNIB, Indonesia)
  • Organizing Committee
    (Telkom University, Indonesia)
  • Dr. Abrar S.Si, M.Sc (Conference Chair)
    • Nurwulan Fitriyanti, S.Pd., M.Si. (Secretary)
    • Tri Ayodha Ajiwiguna, M.Si. P.hD (Program Chair)
    • Dr. Memoria Rosi (Financial Chair)
    • Dr.Eng. Asep Suhendi (Publication Chair)
    • Dr. Casmika Saputra (Public Relations)

Event Location

Bandung, Indonesia

Secretariat of ESIC 2024

Department of Engineering Physics
School of Electrical Engineering
Telkom University, Bandung, Indonesia
Phone: (+62) 812-2381-0177
Email: [email protected]